Participants of the 20th Siam Physics Congress 2025 (SPC2025) are invited to submit full-length research articles for publication in one of the following peer-reviewed journals. This offers a valuable opportunity to showcase your work in established national and international platforms.
Submission Deadline: May 2, 2025
Submission Procedure
- Download the SPC2025 Cover Letter Template
All submissions must include a completed cover letter. Please download the official template. Download - Select Your Preferred Journal
Review the journal options below and choose the one most aligned with your research topic. Submission should be done directly through the journal’s online system using the link provided. - Submit Your Manuscript
Follow the specific submission instructions on the selected journal’s website. Be sure to attach the completed SPC2025 cover letter with your manuscript.
Participating Journals
- KKU Science Journal: Click
- Asia-Pacific Journal of Science and Technology: Click
- Engineering and Applied Science Research – Publication fee: 7,000 THB: Click
- Journal of Physics: Conference Series – Publication fee: 105 USD: Click
- Journal of Metals, Materials, and Minerals: Click
- Journal of Materials Science and Applied Energy: Click
For questions regarding the submission process, please contact the SPC2025 editorial team at E-mail: siamphysicscongress2025@gmail.com. We encourage all participants to take this opportunity to contribute their research to the broader scientific community. Let your work be part of the legacy of SPC2025!